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MPC603EC/D
(Motorola Order Number)
5/95
REV 2
MPR603HSU-03
(IBM Order Number)
The PowerPC name, PowerPC logotype, PowerPC Architecture, and PowerPC 603 are trademarks of International Business Machines Corp.
used by Motorola under license from International Business Machines Corp.
This document contains information on a new product under development by Motorola and IBM. Motorola and IBM reserve the right to
©
Motorola Inc. 1995
Instruction set and other portions
©
International Business Machines Corp. 1991–1995
603 Hardware Specifications
change or discontinue this product without notice.
Advance Information
PowerPC
603
RISC Microprocessor
Hardware Specifications
The PowerPC 603 microprocessor is an implementation of the PowerPC™ family of
reduced instruction set computer (RISC) microprocessors. This document contains
pertinent physical characteristics of the 603. For functional characteristics of the processor,
refer to the
PowerPC 603 RISC Microprocessor User’s Manual.
This document contains the following topics:
Topic Page
Section 1.1, “Overview” 2
Section 1.2, “General Parameters” 4
Section 1.3, “Electrical and Thermal Characteristics” 4
Section 1.4, “Pinout Diagram” 14
Section 1.5, “Pinout Listing” 15
Section 1.6, “Package Description” 17
Section 1.7, “System Design Information” 21
Section 1.8, “Ordering Information” 26
Appendix A, “General Handling Recommendations for the IBM Package” 27
In this document, the term “603” is used as an abbreviation for the phrase, “PowerPC 603
Microprocessor.The PowerPC 603 microprocessors are available from Motorola as
MPC603 and from IBM as PPC603.
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Sommario

Pagina 1 - Advance Information

MPC603EC/D(Motorola Order Number) 5/95REV 2 MPR603HSU-03(IBM Order Number) The PowerPC name, PowerPC logotype, PowerPC Architecture, and PowerPC 603

Pagina 2 - 1.1 Overview

10 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice 14a SYSCLK to output valid (5.5 V to 0.8 V— all except TS, ABB, ARTR

Pagina 3

603 Hardware Specifications, REV 2 11Preliminary—Subject to Change without Notice Figure 4. Output Timing DiagramSYSCLK121413151616ALL OUTPUTS(Except

Pagina 4 - 1.2 General Parameters

12 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice 1.3.3 JTAG AC Timing SpecificationsTable 8 provides the JTAG AC timi

Pagina 5

603 Hardware Specifications, REV 2 13Preliminary—Subject to Change without Notice Figure 6 provides the TRST timing diagram. Figure 6. TRST Timing Dia

Pagina 6

14 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice 1.4 Pinout DiagramFigure 9 contains the pin assignments for the 603

Pagina 7

603 Hardware Specifications, REV 2 15Preliminary—Subject to Change without Notice 1.5 Pinout ListingTable 9 provides the pinout listing for the 603.T

Pagina 8 - ≤ 105 °C

16 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice HRESET 214 Low InputINT188 Low InputLSSD_MODE1205 Low InputL1_TSTCLK

Pagina 9 - ALL INPUTS

603 Hardware Specifications, REV 2 17Preliminary—Subject to Change without Notice Notes:1. These are test signals for factory use only and must be pul

Pagina 10

18 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice 1.6.1.2 Mechanical Dimensions of the Motorola Wire-Bond CQFP Packag

Pagina 11 - VM = Midpoint Voltage (1.4 V)

603 Hardware Specifications, REV 2 19Preliminary—Subject to Change without Notice 1.6.2 IBM C4-CQFP Package DescriptionThe following sections provide

Pagina 12

2 603 Hardware Specifications, REV 2 Preliminary—Subject to Change without Notice 1.1 Overview The 603 is the first low-power implementation of the

Pagina 13 - Figure 6. TRST Timing Diagram

20 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice 1.6.2.2 Mechanical Dimensions of the IBM C4-CQFP PackageFigure 11 s

Pagina 14 - 1.4 Pinout Diagram

603 Hardware Specifications, REV 2 21Preliminary—Subject to Change without Notice 1.7 System Design InformationThis section provides electrical and t

Pagina 15 - 1.5 Pinout Listing

22 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice 1.7.2 PLL Power Supply FilteringThe AVdd power signal is provided o

Pagina 16

603 Hardware Specifications, REV 2 23Preliminary—Subject to Change without Notice Figure 13 provides a thermal management example for the Motorola wir

Pagina 17 - 1.6 Package Description

24 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice Notes: 1. Junction-to-ambient thermal resistance is based on measure

Pagina 18

603 Hardware Specifications, REV 2 25Preliminary—Subject to Change without Notice Figure 14 provides a thermal management example for the IBM C4-CQFP

Pagina 19 - 1.6.2.1 Package Parameters

26 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice 1.8 Ordering InformationThis section provides the ordering informat

Pagina 20 - * Not to scale

603 Hardware Specifications, REV 2 27Preliminary—Subject to Change without Notice Appendix AGeneral Handling Recommendations for the IBM PackageThe fo

Pagina 21 - 1.7.1 PLL Configuration

28 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice A.2 Card Assembly RecommendationsThis section provides recommendatio

Pagina 22 - °C/Watt (junction-to-case)

603 Hardware Specifications, REV 2 29Preliminary—Subject to Change without Notice Clean after reflow De-ionized (D.I.) water if water-soluble paste is

Pagina 23

603 Hardware Specifications, REV 2 3 Preliminary—Subject to Change without Notice • Five independent execution units and two register files— BPU fea

Pagina 24

Information in this document is provided solely to enable system and software implementers to use PowerPC microprocessors. There are no express or imp

Pagina 25

4 603 Hardware Specifications, REV 2 Preliminary—Subject to Change without Notice 1.2 General Parameters The following list provides a summary of

Pagina 26 - PPC 603 – F X– 0XX– X

603 Hardware Specifications, REV 2 5 Preliminary—Subject to Change without Notice Table 3 provides the DC electrical characteristics for the 603.Ta

Pagina 27 - IBM Package

6 603 Hardware Specifications, REV 2 Preliminary—Subject to Change without Notice 1.3.2 AC Electrical Characteristics This section provides the cl

Pagina 28 - A.2.1 Card Assembly Process

603 Hardware Specifications, REV 2 7 Preliminary—Subject to Change without Notice Figure 1. SYSCLK Input Timing Diagram 1.3.2.2 Input AC Specificat

Pagina 29

8 603 Hardware Specifications, REV 2Preliminary—Subject to Change without Notice Table 6. Input AC Timing Specifications Vdd = 3.3 ± 5% V dc, GND = 0

Pagina 30

603 Hardware Specifications, REV 2 9Preliminary—Subject to Change without Notice Figure 2. Input Timing DiagramFigure 3. Mode Select Input Timing Dia

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